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   Sharp Microelectronics of the Americas > Press Room > English Press > 11.13.2003
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Sharp Microelectronics Announces Development of Smart Card with 1MB Flash Memory

 

CAMAS, Wash. – November 13, 2003 – Sharp Microelectronics of the Americas today announced the development of Sharp’s Smart Card with embedded 1MB Flash Memory. The new Smart Card uses Sharp’s 0.18 um process and five metal connection process. Compared with the industry’s use of 0.25 um process, Sharp’s migration to a 0.18 um process demonstrates the company’s leadership in developing high-density memory technology for Smart Cards.

Samples of the 1MB module will be available in December 2003, followed by the 512 kilobyte version in April 2004.

Sharp previously developed a multi-application Smart Card with the highest density built-in memory and reduced cell size in the industry. The use of Smart Cards for multiple applications, such as e-passports, will increase in the Smart Card industry alongside the growth of single-application card programs, such as transportation, medical and corporate ID cards.

Because its cell size is too large, traditional Smart Card chips composed of mask ROM and EEPROM are not suitable for high-density memory on multi-application Smart Cards. In contrast, the internal 1MB memory capacity is specifically tailored to support multi-application operating systems and expanded application sizes. The process reduction achieved with this new Smart Card results in a die size almost as small as traditional density EEPROM die size with more than double density.

“We developed the new chip by leveraging our strength in process technology,” said Robert Stuart, Product Manager at Sharp Microelectronics of the Americas. “Scaling down the process and using multiple wiring layers allows a substantial reduction in chip size, lower power consumption and high-speed performance. This process also provides higher chip security by forming a protection layer over the die.”

Sharp is also planning to be certified to meet the internationally accepted IT security requirements known as Common Criteria and is planning to meet the needs of the market by implementing GlobalPlatform, which is suitable for using multi-applications on one card.

Features of the new 1MB Flash Memory Smart Card include:

  • New process for Smart Card LSI, at 0.18um embedded Flash memory;
  • High security with the protection layers using five metal wiring;
  • More than double density in same die size as compared to the traditionally structured LSI;
  • Low noise and a 20 percent decrease in power consumption with low voltage.

Item
Specification
CPU 16 bit Sharp original
Memory ROM 8 kilobytes
RAM 8 kilobytes
Flash 1024 kilobytes
Coprocessor RSA/ECC accelerator
DES encryption circuit
Security function

Countermeasure for SPA/DPA
Variable sensors (voltage supply, clock frequency)
Malfunction detection, and shielding

Input clock frequency

1-5 MHz

Form of shipment

Card (ID-1, ID-3), module


About Sharp Microelectronics of the Americas
Sharp Microelectronics of the Americas, Camas, Wash., is a U.S.-based company and a division of Sharp Electronics Corporation, which is a subsidiary of Sharp Corporation, Osaka, Japan. Sharp is a worldwide developer of core digital technologies that are playing an integral role in shaping the next generation of electronic products for consumer and business needs. Sharp Microelectronics of the Americas offers breakthrough memory, LCD, Optoelectronics, CCD, RF/IR, microcontroller and system-on-chip components, along with packaging and integration skills that help design engineers throughout North and South America bring their ambitious ideas to market. Sharp Microelectronics of the Americas is dedicated to improving people’s lives through the use of advanced technology and a commitment to innovation, quality, value and design. For more information, visit www.sharpsma.com.
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